Special Purpose Adhesive Formulation (19)

Photosensitive adhesive

GM-924 photosensitive adhesive

Component dosage /g component dosage /g
711 Epoxy Acrylic Acid Diester 60 Benzophenone 1.5
Methyl methacrylate 40

Preparation and curing Use a 500-700W high-pressure mercury lamp and illuminate it for 3 to 5 minutes at a distance of 10cm.

Uses The cold resistance of this glue is good, its performance does not change basically after alternating three times in -10~25. The glue is mainly used for bonding transparent materials such as organic glass.

Modified epoxy photosensitive adhesive

Component dosage /g component dosage /g
Anhydride Modified Acrylic Epoxy Resin 5 DEE Liquid 1 0.3
Vapor White Carbon 0.3
1DEE liquid component component dosage/g component dosage/g
Benzoin ethyl ether 20 Dibutyl phthalate 75
Benzoyl peroxide 5

Preparation and curing UV irradiation 1min, and then cured at 100 ~ 120 °C 4h.

Use The glue has good resistance to cold and heat, and its strength does not change for three times at -55 to 60°C. It is mainly used for gyro wiring bonding and transparent material bonding.

Epoxy acrylic light per glue

Component dosage /g component dosage /g
Aerosol Acrylic 100 Hydroquinone 0.075
DAP 30 Phthal II 5
Benzoin ether

Preparation and curing Curing with UV radiation.

Use This adhesive is mainly used for bonding ceramic resonators and color television precision delay lines.

GM-1 light per glue

Component dosage /g component dosage /g
GM-1 resin 100 benzoin ether 4
Styrene 55

Preparation and Curing with a 3650A High Pressure Mercury Lamp

Uses The glue is mainly used for bonding of transparent materials.

Photovoltaic element adhesive

Component dosage /g component dosage /g
Epoxy resin (epoxy equivalent weight 180-350) 100 Silica powder (average particle size 5-55 nm) 10.0
Dye ≤5

The above components are mixed to obtain the glue.

Use The glue hardens, can pass through infrared rays, has good chemical properties, good durability and water resistance, high mechanical strength, and good heat resistance. Suitable for optoelectronic components.

Epoxy adhesive agent

Component dosage /g component dosage /g
Bisphenol A-Diglyceryl Ether 3.097 Ethylene Glycol Bis(N-Benzylaminoethyl Ether) 1.839
Dipropylene triamine 0.183

Preparation The three components were mixed according to the amount of the above formulation to obtain an adhesive. Applicable period 4h.

use
The glue can bond silicon crystal quartz plates to the convex glass surface, and then solidify for 3-4 days. After the stress is released, a crystal body with a precise size and solidification is obtained, and the quilt adhesion object has a good stability. And durability, suitable for installation of optical instruments and equipment, can be used on X-ray microscopes.

Aluminum reflectors for light reflectors

Composition ω/100%
EVA (VA contains 28% 0 90
Maleic anhydride modified ethylene propylene copolymer 10

Preparation Prepare the adhesive according to one of the components described. A 25 μm thick poly(ethylene terephthalate) sheet, plated with metallic aluminum, was set on the sheet under vacuum and then coated with the above adhesive. The coating thickness was 50 μm, and a 3 mm-thick PS sheet was pressed one at a time to prepare a composite sheet.

Use The adhesive is used for the bonding of light reflector laminated products.

Optical plastic

Component dosage /g component dosage /g
A, colorless epoxy resin 100 B, curing agent (diethylene triamine - butyl diglycidyl ether adduct) 25
Methyl methacrylate 10
19 Unsaturated Polyester 5 KH-5605
Dibutyl phthalate 5
501 epoxy butyl ether 10 to 20

After preparation and curing, the outdoor temperature is cured for 8 to 12 hours.

Use This glue is mainly used for bonding optical components, making transparent materials such as radium fired glass, and has good curing toughness.

Light-hard epoxy adhesive

Component dosage /g
Diphenylsulfonium tetrafluoroborate salt 0.20
Fluorine-containing aliphatic epoxy resin

CH2-CH-CH2OCH2OCH2(CF2)6CH2OCH2-CH-CH2

\/ \/

0 0

Preparation and curing
The two-side three-knife components were mixed and heated to dissolve to obtain an almost uniform solution, which was applied to an off-board with a thickness of 300 μm. Ultra-high pressure mercury lamps were irradiated for 30 s at a distance of 6 cm to obtain a hard kung fu compound.


Source: 21st Century Fine Chemicals Network

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